Single component moisture curing adhesive

The HX-8008 series is a single component, moisture cured elastic adhesive at room temperature. Solvent-free, non-toxic and odorless, heat-resistant, cold resistant, and strong adhesive properties. HX-8008 has a wide range of adhesive applications, and can be used to bond various substrates such as plastic, rubber, metal, glass, ceramics, wood, etc.

The HX8008 series moisture curing adhesive is widely used in the bonding, sealing, and protection of electronic components, semiconductor materials, electronic appliances, and other equipment.

Product properties

project

HX-8008C

HX-8008W

HX-8008B

Main components

Modified polyether resin

appearance

Pale yellow semi transparent liquid

White viscous liquid

Black viscous liquid

Density, @ 23 ℃, (g/cm3）

1.05

1.25

1.25

Viscosity, @ 23 ℃, (pa. s)

75~85

75~85

75~85

Table drying time, @ 23oC(min)

10~20

10~20

10~20

Curing depth, mm/24h

1~2

1~2

1~2

Hardness, (Shore A)

45

45

50

Glass transition temperature Tg, (℃)

-58

-58

-58

Breaking strength, (N/mm2）

2.5

2.5

1.5

Elongation at break,%

>200

>200

>300

Volume resistivity（Ω.cm）

1.10E 12

1.20E 12

1.20E 12

Dielectric constant, (100Hz)

6.14

7.10

7.10

Dielectric loss tangent (100Hz)

0.11

0.23

0.35

Shelf life, (months @ 5-35)oC）

12

12

12




List of Main Performance Parameters

产品物性

项目

HX-8008C

HX-8008W

HX-8008B

主要成分

改性聚醚树脂

外观

微[敏感词]半透明液体

白色粘稠液体

黑色粘稠液体

密度，@23℃,（g/cm3）

1.05

1.25

1.25

粘度，@23℃,（pa.s）

75~85

75~85

75~85

表干时间，@23oC(min)

10~20

10~20

10~20

固化深度，mm/24h

1~2

1~2

1~2

硬度，（Shore A）

45

45

50

玻璃化转移温度 Tg，(℃)

-58

-58

-58

断裂强度，（N/mm2）

2.5

2.5

1.5

断裂伸长率，%

>200

>200

>300

体积电阻率，(Ω.cm）

1.10E+12

1.20E+12

1.20E+12

介电常数，（100Hz）

6.14

7.10

7.10

介电损耗角正切（100Hz）

0.11

0.23

0.35

保质期，（月@5~35oC）

12

12

12