HX-8200CIt is a single component, UV and heat dual curing epoxy adhesive,Can enhance the degree of solidification,Enhanced performance, designed for precise alignment of adhesive protection for precision electronic components. Special product process formula, initially positioned by UV to achieve initial bonding strength, and then cured in a suitable high-temperature environment to achieve better bonding strength. The initial positioning intensity of its UV light can adapt to the necessary displacement adjustment and initial intensity requirements during the assembly process. It is suitable for bonding metals, ceramics, and plastics (such as PC, LCP, PI, ABS, PPT, PPS, etc.), as well as bonding temperature sensitive components.

Product Features

.    fast UV Curing can accurately and quickly locate components.

.    Can be cured at low temperature, minimum80℃It can be solidified.

.    High thixotropy, low flow.

.    Low curing shrinkage rate.

.    Low volatile matter.

.    Operating temperature: -40 ~ 150℃.

.    conform toRoHS and  REACH.