HX-1022 Three proof Adhesive Series

The main component of HX-1022 is polyurethane modified alkyd resin, which is a transparent benzene free solvent based three proof adhesive; It is mainly used on electronic and electrical circuit boards to provide coating protection for components, especially for PCBA solder joints, effectively protecting important components (such as SMD) from harsh environments such as moisture, salt spray, and mold, improving the high temperature resistance and electrical insulation performance of electronic and electrical appliances; No corrosion to components; Can be cured at low temperature.


List of Main Performance Parameters

state

project

Parameter performance

Before curing

appearance

Light yellow to light brown transparent liquid

Specific gravity (25 ℃)

0.80-0.90

Solid content

37%-45%

Viscosity (four cups coated/25 ℃)

12-25 seconds

Curing and shaping

Volume resistance (Ω cm)

2.0*1015

Surface resistance (Ω cm)

2.6*1015

Adhesion (Hundred grid knife)

class a

Water absorption rate: Soak at 25 ℃ for 24 hours

<0.5%

Pencil hardness

3~4H

Dielectric strength (KV/mm)

112

Dielectric constant

3.2

Loss factor (1 MHz 25C)

0.02

High temperature resistance performance

Capable of withstanding high temperatures of 134 ℃ with unchanged performance

Flame retardancy

UL 94 V0