HX-2022 UV moisture coating material


The main component of HX-2022 is polyurethane modified acrylic acid, which is a solvent-free UV moisture dual curing three proof adhesive; It is widely used on the surfaces of printed circuit boards, electronic components, integrated circuits, etc., forming a dense protective film to protect various electronic components and solder joints; Can be cured by UV and moisture dual curing, and for shaded areas that cannot be cured by light, it can be cured within 3-5 days; It is a high-end product with excellent performance such as chemical resistance, high temperature resistance, high adhesion, and high hardness.


List of Main Performance Parameters

state

project

Parameter performance

Before curing

Specific gravity, 25 ℃ g/cm3

1.03

Viscosity, 25 ℃ CPS

150 /-50

Curing speed (surface dry/full solid)

2-5s/25s (thickness 30-60um, 1000W 365nm)

Curing and shaping

Thermal expansion coefficient (TMA) ppm/℃

87 (less than Tg)
181 (greater than Tg)

Modulus (DMA), 25 ℃, MPa

230

Hardness (Shore D)

65

Volume resistivity Ω. m

1.6*1015

Dielectric constant (1MHz)

3.2

Dielectric strength (KV/mm)

60

Surface resistance Ω

2*1015

Shear strength MPa

>10

Tg (DSC)

45.5℃

High temperature resistance performance

Capable of withstanding high temperatures of 200 ℃ with unchanged performance

Solvent resistance

excellent